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7 VOTES

It has an aluminum fin base to disperse heat, as well as two copper heat pipes, in conjunction with an 80mm fan.

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Pros

steady performance that lasts a long time before it needs replacing

1 agrees

can transfer enough heat for an overclocked CPU

1 agrees

makes only a little noise, can't really hear it with the case closed

1 agrees

low profile design doesn't take up much room in the case

1 agrees

installation is simple enough for first-time users, no trick to it

1 agrees
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Cons

not enough heat transfer for overlocking multiple-core processors

1 agrees

pipes are copper, but the base isn't - doesn't transfer as much heat as it could

1 agrees
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Edit

 

 Thermaltake's Slim X3 is a heat sink intended for use with Intel processing units, specifically with socket LGA1156 and LGA775 (this covers a wide range of processors, from Celeron to Core i5 - check the manufacturer page for full compatibility). It has an aluminum fin base to disperse heat, as well as two copper heat pipes, in conjunction with an 80mm fan. One main feature of this model is its low profile, as its thickness is just 36mm. This makes it the thinnest of Thermaltake's heat sinks for these socket types, and more amenable for use in slim computer cases. It has a mid-range price, and falls roughly in the middle of Thermaltake's CPU cooling lineup. Installation is relatively simple, requiring four screws.

Features
  • Aluminum fin heat sink plate
  • Dual copper heat pipes
  • 80mm fan
  • 36mm thickness
  • Ideal for slim cases
  • Compatible with socket LGA1156 and LGA775 Intel processors
  • Noise level: 20-26.9 dBA
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